About this Course
MJM Engineering regulargy sponsors a one-day workshop that aims to provide an understanding of the issues involved in the thermal management of electronic and telecommunication systems. The course covers the principles and the tools available to the design engineer. This course is designed to help engineers and technicians with some thermal background (but new to the electronics, telecommunications field) understand the thermal challenges and demands of the electronics fields. Experienced engineers will also find the course very instructive and useful.
Overview of Thermal Problems in Electric, Electronic, and Telecom Components and Systems
Overview of Fundamentals and Theory: Heat Transfer, Fluid Mechanics, and Thermal Systems.
Thermal Characterization of Components: Thermal Resistance Concept, Junction Temperatures, Cooling, Heating Loads, etc.
Thermal Management of Outdoor Equipment: Active, Semi-active or Passive Cooling; Solar Loads.
Overview of Numerical Simulation, Background, Review and Evaluation of Commercial CFD Software Packages/ Tools
Review and Evaluation of Thermal Management Equipment:-----Heat Sinks, Heat Pipes, Microchannel Heat Sinks, Fans and Blowers, Thermoelectric, Interface Materials, Phase Change Materials, etc.
Overview of Thermal Management of Indoor and Outdoor Telecom Systems
Experimental Methods in Electronics/Telecom Cooling Equipment
Please click here for the current Thermal Management Short Course.